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LANGUAGE
PRODUCT SPECIFICATION
ENVIRONMENTAL
ENGLISH
Item
Vibration
Shock
Moisture Resistance
Solderability
Temperature Rise
Test Condition
Mate dummy card and sbject to the
following vibration conditions, for a period of
2 hours in each of 3 mutually perpendicular
axis, passing DC 1mA during the test.
Amplitude : 1.52mm P-P
Frequency : 10-55-10 Hz
shall be traversed in 1 minute.
( MIL-STD-202 Method 201 )
Mate dummy card and subject to the
following shock conditions. 3 shocks shall
be applied along 3 mutually perpendicular
axis, passing DC 1mA current during the
test. ( Total of 18 shocks)
Test Pulse: Half Sine.
Peak Value : 490m/s 2
Duration : 11ms
( MIL-STD-202 Method 213,)
Matedummy card and subject to the condi-
tions specified on per.( 6) for 9 cycles. The
test specimens shall exposed to step 7a
during only 5 out of 9 cycles. A 10th cycles
consisting of only step 1 through 6 is then
performed, after which the test specimens
shall be conditioned at ambient room condi-
tions for 24 hours.
(MIL-STD-202 Method 106)
Dip solder tails into the molten solder ( held
at 230 +5 o C/-5 o C ) up to 0.5mm from the tip
of tail for 3+/-0.5sec.
Mated with dummy card measure the
temperature rise at the rated current after
96 hours
Requirement
Appearance : No damage.
Contact resistance: 100 milliohms
MAX.
Discontinuity: 1 microsecond MAX.
Appearance : No damage.
Contact resistance: 100 milliohms
MAX.
Discontinuity: 1 microsecond MAX.
Appearance : No damage
Contact resistance: 100 milliohms
MAX.
Dielectric strength : Must meet
electrical requirement.
Insulation resistance : 100 Megohms
Minimum.
Solder coverage : 95 % Min.
Temperature rise
30 o C Maximum
A
REV
REVISE ON PC ONLY
SEE SHEET 1
DESCRIPTION
TITLE
SD MEMORY CARD CONNECTOR FOR CARD
HEADER WITH EJECTOR MECHANISM
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX
INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DOCUMENT NO.
DIMENSION CLASS:
FILE NAME
SHEET
PS-67913-002
C
RITICAL
=0
MAJOR = 0
PS-67913-002.
PDF
5
.PDF
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